Die Bonder X10M
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- Details
| Applications: | |
| 1 | Multi-die bonding application |
| 2 | Suitable for TIA/DRV/PD/VCSEL die bonding of optical transceiver |
| Basic functions | |
| 1 | Suitable for COB/BOX/TO package |
| 2 | Vision System: support customer design upon product |
| Technical specification | |
| 1 |
Wafer X/Y Table: Maximum Travel： 8″*8″（230mm*230mm） Accuracy： ±15um@3σ Wafer Input: ø6″ or ø8″（Optional） Z axis travel of needle： 3mm |
| 2 |
Die bonding XY Table： Maximum Travel： 4″*8″（130mm*230mm） Accuracy： ±0.3mil Repeatability： ±0.2mil |
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